About Northern Technologies – A Division of EDAC (America) Ltd.

Since 1982, Northern Technologies Corp. has been a leader in the design and manufacture of standard and custom high-performance shielding products for the data communications industry. Our portfolio includes connector covers and a wide range of D-subminiature, SCSI, V.35, fibre channel (GBIC), telco, RJ, and modular interconnect solutions.

As part of the broader EDAC Group of Companies, Northern Technologies brings specialized expertise in shielding, mechanical protection, and accessory solutions that complement the group’s full interconnect offering. This alignment allows us to support customers not just at the component level, but across complete connectivity systems that combine board-level, I/O, and ruggedized interconnect solutions with the shielding and hardware required to ensure performance in real-world environments.

In addition to our standard product lines, we offer custom hardware solutions including thumbscrews, machine screws, captive screws, and metal drawn cans; delivering a more complete and integrated approach to interconnect design.

Our recognized expertise in D-sub backshell design and quality manufacturing drives the continued development of forward-looking connection technologies. Products are engineered around customer requirements and evolving application demands, with many standard solutions available under the Northern Technologies brand. Our in-house CAD, solid modeling, and mechanical simulation capabilities ensure reliability and performance before investment in tooling, reducing risk and accelerating development timelines. Our quality system extends from raw material inspection through final production, with products verified to rigorous standards and supported by a disciplined approach to manufacturing and installation.

As part of the EDAC Group, we operate with a shared focus on customer-driven solutions, responsiveness, and engineer design partnership. Delivering the flexibility and technical depth required to solve today’s interconnect challenges.